Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW).

 


SEMICONWELL
Integrated Passive Networks
LC FILTERS ARRAYS-INDUCTORS CAPACITORS ESD PROTECTION NETWORK
SWLCL LC L FILTERS-INDUCTOR CAPACITOR LC FILTER NETWORK
SWLCLESD LC L FILTERS-INDUCTOR CAPACITOR + ESD PROTECTION LC FILTER NETWORK
SWLCT LC T FILTERS-INDUCTOR CAPACITOR LC FILTER NETWORK
SWLCLTESD LC T FILTERS-INDUCTOR CAPACITOR + ESD PROTECTION LC FILTER NETWORK
SWLCPI LC PI FILTERS-INDUCTOR CAPACITOR LC FILTER NETWORK
SWLCPIESD LC PI FILTERS-INDUCTOR CAPACITOR + ESD PROTECTION LC FILTER NETWORK
 

Semiconwell LC Filters are designed to provide both ESD protection and EMI filtering for high-speed data ports, I/O ports, LCD interfaces for wireless handsets, handheld PCs and PDAs applications. Semiconwell LC filters are available in industry standard surface mount packages -SMD, molded lead frame as well as in chip scale package. Semiconwell chip scale package is a high reliability flip chip assembly manufactured in GOLD CHIP TECHNOLOGY TM. GOLD CHIP TECHNOLOGY TM is a Trade Mark of SEMICONIX Corporation. GOLD CHIP TECHNOLOGY TM is the most advanced packaging method today. It allows fast prototyping as well as fast production ramp-up. For more information about GOLD CHIP TECHNOLOGY ™, check SEMICONIX web site.
   

Home>Inductor Capacitor Arrays> Last updated: April 23, 2007

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