SPIRAL CHIP INDUCTORS LX5000Q20-L02-2nH is same as L02-2nH-20Q FEATURES Spiral chip inductors are available in 2 different die dimensions: For 1 turn to 21 turns series the die size is 0.050"x0.050"x0.020". For 1 turn to 5.5 turns the spiral chip inductors are also available in die size of 0.030"x0.030"x0.020". The LX5000Q20-L02-2nH spiral chip inductors are manufactured on quartz (SiO2), 20 mils thick. APPLICATIONS These devices can be used over the full military temperature range -55C to +125C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs. Spiral Chip Inductors Lab kits are available from stock: L-Kit Application note: AN 102 PRODUCT DESCRIPTION The LX5000Q20-L02-2nH Series of spiral chip inductors are designed to be used in chip and wire hybrid circuits as RF choke in power supplies and microwave circuit resonant elements. When used as chokes, a modest Q is desirable while in oscillators Q has to be as high as possible. Semiconwell advanced thin film technologies allow for an important reduction of the DCR max, which translates into an increased Q. For spirals with w+s=25m, Q values between 25 and 30 are obtained which represent a better compromise between the two applications. For lowest capacitance and higher self resonance, the LX5000Q20-L02-2nH spiral chip inductors are manufactured on 20 mil thick quartz (SiO2) substrates. Application note AN 102 describes the recommended assembly for best performance. MICROWAVE APPLIED THIN FILM PRODUCTS MANUFACTURING PROCESS DESCRIPTION All thin film microwave products are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell products are available in die form and are ideal for high reliability hybrid and multi chip module applications. SUBSTRATE INFORMATION INDUCTOR SPECIFICATIONS Material SiO2 -Quartz Thickness 201 mil Die size 50x50&plswn;3 mils, 30x30&plswn;3 mils Current rating 100mA@70°CTolerance 20 % Capacitance <0.030pF CONDUCTORS The conductor and bonding pads are 3m thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400C in air without loss of adhesion. BACKSIDE METALS Backside of the die is NOT metallized. Standard TiW/Au or custom metallization is available for special orders. ELECTRICAL CHARACTERISTICS Inductance 2nH , Inductance Tolerance (Absolute) + 25°C 20.0 % DC Resistance typ. 0.1W Current Rating: Max. 100mA@70°C Quality Factor Q @ 100MHz typ. 25.5 Series Self Resonance SRF typ. ff GHz Parallell Self Resonance PRF typ. ff GHz Operating Temperature Range - 55 to + 125°C Storage Temperature Range - 55 to + 125°C PRICES, DELIVERY & ORDERING INFORMATION PART# L01-01nH-20Q Minim Order 100pc U/P($) $3.20 All Semiconwell products are available in die form. Typical delivery for die products is 1-2 weeks ARO. For Custom designs, delivery is 2-3 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are shipped in waffle packs. Semiconwell has made every effort to have this information as accurate as possible. However, no responsibility is assumed by Semiconwell for its use, nor for any infringements of rights of third parties which may result from its use. Semiconwell reserves the right to revise the content or modify its product line without prior notice. Semiconwell products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of Semiconwell.

 
 
SEMICONWELL
Integrated Passive Networks
  SPIRAL CHIP INDUCTORS
LX5000Q20-L02-2nH
 
 

FEATURES
APPLICATIONS
SPIRAL CHIP INDUCTOR
Spiral chip inductors are available in 2 different die dimensions: For 1 turn to 21 turns series  the die size is 0.050"x0.050"x0.020". For 1 turn to 5.5 turns the spiral chip inductors are also available in die size of 0.030"x0.030"x0.020".
The LX5000Q20-L02-2nH spiral chip inductors are manufactured on quartz (SiO2), 20 mils thick..
These devices can be used over the full military temperature range -55C to +125C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs.

Spiral Chip Inductors Lab kits are available from stock: L-Kit

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
The LX5000Q20-L02-2nH Series of spiral chip inductors are designed to be used in chip and wire hybrid circuits as RF choke in power supplies and microwave circuit resonant elements. When used as chokes, a modest Q is desirable while in oscillators Q has to be as high as possible. Semiconwell advanced thin film technologies allow for an important reduction of the DCR max, which translates into an increased Q. For spirals with w+s=25µm, Q values between 25 and 30 are obtained which represent a better compromise between the two applications. For lowest capacitance and higher self resonance, the LX5000Q20-L02-2nH spiral chip inductors are manufactured on 20 mil thick quartz (SiO2) substrates. Application note AN 102 describes the recommended assembly for best performance.

SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

ELECTRICAL CHARACTERISTICS
PARAMETER VALUE UNITS
Number of turns 2   
Inductance 2 nH
Inductance Tolerance: Absolute, +25°C &plswn;20.0 %
DC Resistance typ. 0.1 W
Current Rating: Max. @ + 70°C typ. 100 mA
Quality Factor Q @ 100MHz typ. 26.1  
Series Self Resonance SRF typ. 78 GHz
Parallell Self Resonance PRF typ. 39.5 GHz
Operating Temperature Range - 55 to + 125 °C
Storage Temperature Range - 55 to + 125 °C

frequency characteristics
inductor model
capacitance model

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal
SiO2 - Quartz 20&plswn;1 50 x 50&plswn;3 min 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier Backside of the die is NOT metallized. Standard TiW/Au  or custom metallization is available for special orders.
All Semiconwell products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

DIE LAYOUT - MECHANICAL SPECIFICATIONS
 

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS PRICE LIST
SW PART # Waffle Packs MINIMUM ORDER QUANTITY U/P($)
SW LX5000Q20-L02-2nH -WP 100pc $3.20
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
Semiconwell P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.semiconwell.com/purchase_order.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! Semiconwell guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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