CHIP SCALE PACKAGE 0603 PRECISION THIN FILM RESISTOR SWFCRN306-CSP FEATURES Standard 0603 Format SMD chips Absolute tolerance 0.1% Temperature Coeficient (TCR) of 25 ppm/°C/ Ceramic substrate APPLICATIONS Voltage dividers Current sensing Current limiting Precision gain setting SHORT PRODUCT APPLICATION NOTE The SWFCRN306 resistors offer a high degree of stability and low noise as well as the proven reliability characteristics of Tantalum Nitride. The SWFCRN306 Series offers the advantages of a CSP ( Chip Scale Package). The devices are built on ceramic with solder bumps for direct placement onto printed circuit boards. They are compatible with 0603 footprint. SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION Integrated passive networks are manufactured using advanced thin film technologies including ultrastable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. RESISTOR SPECIFICATIONS Capacitance [pF] Tolerance q [%] Power Rating [mW] <0.20pF 1, 5, 10 200 mW@70°C Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. ELECTRICAL CHARACTERISTICS PARAMETER VALUE UNITS Resistor Range 40 ohms to 150 Kohms Resistor Tolerance min ±0.1 % Operating Voltage max. 100 Vdc MaximumResistor Power,at 70°C 0.2 W Temperature Coefficient of Resistance ±100 ppm/°C Storage Temperature Range -65°C to +150 °C Operating Temperature Range -55°C to +125 °C GENERAL DIE INFORMATION Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal Al2O3 99.6 % 15±2 60.9x33.4±2 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach. All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products. CONDUCTORS RESISTORS BACKSIDE METAL Bump Height 5 mils (±1 mil) Pad Size 7.87x25.98 mils Bump Size 6.5x24.6 mils Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. STANDARD PRODUCTS ORDERING INFORMATION R R multiplier TOLERANCE R value 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 R multiplier 1 10 100 1,000 10,000 -5% -2% -1% -0.5% -0.1% SW PART # QUANTITY CSP U/P($) SWFCRN306/RCODE-1% 5,000pc -CSP SWFCRN306/RCODE-1% 10,000pc -CSP For custom products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com INSTANT QUOTE Semiconwell P/N Quantity E-mail Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts. Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met. SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

 
 
SEMICONWELL
Integrated Passive Networks
  CHIP SCALE 0603 PRECISION THIN FILM RESISTOR
SWFCRN306-CSP
 
 

FEATURES
APPLICATIONS
SCHEMATIC
Standard 0603 Format
SMD chips
Absolute tolerance 0.1%
Temperature Coeficient (TCR) of 25 ppm/°C/
Ceramic substrate
Voltage dividers
Current sensing
Current limiting
Precision gain setting

SHORT PRODUCT APPLICATION NOTE
The SWFCRN306 resistors offer a high degree of stability and low noise as well as the proven reliability characteristics of Tantalum Nitride. The SWFCRN306 Series offers the advantages of a CSP ( Chip Scale Package). The devices are built on ceramic with solder bumps for direct placement onto printed circuit boards. They are compatible with 0603 footprint.

SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

RESISTOR SPECIFICATIONS
Capacitance [pF] Tolerance q [%] Power Rating [mW]
<0.20pF 5, 2, 1, 0.5, 0.1 200 mW@70°C

Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTICS
PARAMETER VALUE UNITS
Resistor Range
40 to 150,000
W
Resistor Tolerance
min ±0.1
%
Operating Voltage
max. 100
Vdc
MaximumResistor Power,at 70°C
0.2
W
Temperature Coefficient of Resistance
±100
ppm/°C
Storage Temperature Range
-65°C to +150
°C
Operating Temperature Range
-55°C to +125
°C

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads
Al2O3 99.6 % 15±2 60.9x33.4±2 min 4x4 mils, 3mm thick, pure tin Sn or SnPb solder
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.

CONDUCTORS RESISTORS BACKSIDE METAL
Bump Height 5 mils (±1 mil)
Pad Size 7.87x25.98 mils
Bump Size 6.5x24.6 mils
Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only.

CASE LAYOUT PACKAGE PIN OUT

Dimensions are in mils

STANDARD PRODUCTS ORDERING INFORMATION

R R multiplier TOLERANCE
Find part #

SW PART # QUANTITY CSP U/P($)
SWFCRN306/RCODE-1%   5,000pc -CSP  
SWFCRN306/RCODE-1% 10,000pc -CSP  
For custom products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com

INSTANT QUOTE
Semiconwell P/N Quantity E-mail    
 

Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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