| SCSI Dual Thevenin termination network Stable resistor network multiple terminating line/package Save board space and reduces assembly cost SCSI Termination Thevenin termination Peripheral devices like drives, printers, and CD-ROMs are connected to host through a special bus called SCSI(Small Computer System Interface). The fast edge rated signals that are transmitted through the SCSI cable generate ringing on the bus. This will slow down communication between host and peripherals. The SCSI standard recommends proper resistor (Thevenin) termination at host and peripheral locations to eliminate transmission line effects. Dual Thevenin Termination Networks offer high integration and performance in a miniature QSOP or SOIC package, which saves critical board area and provides manufacturing cost and reliability efficiencies. A terminating resistror is used to reduce or eliminate unwanted reflections on a transmission line. It can perfom this function only when its resistance value matches the characteristic impedance of the transmission line. The resistors used for terminating the transmission lines should be noiseless, stable and functional at high frequencies. Unlike thin film-based resistor networks, conventional thick film resistors used for terminating transmissinon lines are not stable over temperature and time and impose system performance limitations at very high frequencies. Integrated passive networks are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1Ω/sq to 10,000 Ω/sq. All Semiconwell's products are available in die form and are ideal for high reliability hybrid and multi chip module applications. |
| SEMICONWELL
Integrated Passive Networks |
HIGH SPEED TRANSCEIVER LOGIC DUAL THEVENIN TERMINATION NETWORK SWRDT/Rxx/Ryy-24A |
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| SHORT PRODUCT APPLICATION NOTE |
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High speed logic such as HSTL (High Speed Trans-ceiver Logic) require suitable signal termination.
The SWRDT-24A Dual Thevenin termination network provides 16 terminating channels per package, and
optimizes signal integrity by reducing reflections and ringing. The terminations are available in
a range of standard values and are ideal for use in HSTL busses. As seen in the device schematic,
R1 is typically tied to V+ and serves as a pull-up resistor, while R2 functions as a pull-down resistor
and is tied to ground (or the most negative supply voltage). In addition, the equivalent Thevenin
resistance (R1 in parallel with R2) should match the impedance of the trace. Ground-bounce and crosstalk are virtually eliminated using four direct ground connections to the die substrate, as well as four double-bonded connections to V+, for a total of 8 commons. In addition, the resistors have an absolute tolerance of 1% which provides tight impedance-matching and results in greatly reduced reflections. This design provides optimal signal integrity. |
| SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION |
| Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 Ω/sq to 10,000 Ω/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. |
| RESISTOR SPECIFICATIONS | ||
| Capacitance [pF] | Tolerance q [%] | Power Rating [mW] |
| <5pF | 1 | 100 mW@70°C/resistor |
| Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. |
| GENERAL DIE INFORMATION | ||||
| Substrate | Thickness (mils) | Die size (mils) | Bonding pads | Backside metal |
| SiO2 / Silicon | 10±2 | 90 x 60 ±3 | 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier | Au/Si compatible with eutectic and conductive epoxy die attach. |
| All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products. | ||||
| CONDUCTORS | RESISTORS | BACKSIDE METAL |
| The bonding pads of the resistors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. | Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10Ω/sq and Rsq>500Ω/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KΩ and 25mW for R>1KΩ. Standard tolerance is ±5%. | Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only. |
| DIE LAYOUT | PACKAGE PIN OUT |
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| Termination inputs: 1-3,6-7,10-15,18-19,22-24 | |
| Common positive power supply voltage V+=4,9,16,21 | |
| Common negative power supply GND (or V-)=5,8,17,20 | |
| Vdd=die backside | |
| STANDARD PRODUCTS ORDERING INFORMATION |
| SW PART # | QUANTITY | QSOP-24 | U/P($) | BARE DIE | U/P($) |
| SWRDT/RCODE-1% | 5,000pc | -24AQS | -24ABD | ||
| SWRDT/RCODE-1% | 10,000pc | -24AQS | -24ABD | ||
| For custom products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com | |||||
| Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts. |
| Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met. |
| SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. |
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