IC Packaging services for Semiconwell board level electronic integrated passive networks, integrated circuits and discrete components include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package, MSOP-mini small outline package,MLP-micro leadframe package, MILLIPAQ- micro package, QSOP- quarter size smal outline package,SSBGA-small scale ball grid array-wire bond, SSBGA-FC small scale ball grid array-flip chip, SDBGA-small scale ball grid array-stacked die, SOIC-small outline integrated circuit,SOICW-small outline integrated circuit wide body, SOT-small outline transistor,SSOP-shrink small outline package, TSSOP-thin shrink small outline package, FCOL-flip chip on lead frame-Carsem TM,MQFP-metric quad flat pack, LQFP-low quad flat pack,TQFP-thin quad flat pack, VSOP-very small outline package.

IC Packaging services for Semiconwell board level electronic integrated passive networks, integrated circuits and discrete components, resistors, capacitors, inductors, ESD diodes, Schottky diodes, transient surge suppressors, TVS transorb and Zener diodes, include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package, MSOP-mini small outline package,MLP-micro leadframe package, MILLIPAQ- micro package, QSOP- quarter size smal outline package,SSBGA-small scale ball grid array-wire bond, SSBGA-FC small scale ball grid array-flip chip, SDBGA-small scale ball grid array-stacked die, SOIC-small outline integrated circuit,SOICW-small outline integrated circuit wide body, SOT-small outline transistor,SSOP-shrink small outline package, TSSOP-thin shrink small outline package, FCOL-flip chip on lead frame-Carsem TM,MQFP-metric quad flat pack, LQFP-low quad flat pack,TQFP-thin quad flat pack, VSOP-very small outline package.

SEMICONWELL
Integrated Passive Networks

SEMICONWELL STANDARD SINGLE INLINE PACKAGE INFORMATION
SIP 4, 7/8, 9, 10 PIN 300 mil- SINGLE INLINE PACKAGE OUTLINE	SIP 12, 14, 20,24 PIN 600 mil- SINGLE INLINE PACKAGE OUTLINE

	SIP SINGLE INLINE PACKAGE is a rectangular through hole mount with leads located on one length sides of the package. SIP packages, derived from PDIP, are JEDEC compliant. The lead pitch is the same, 0.1 mils. Sizes vary from 4 to 24 pins. IC Packaging services for Semiconwell board level electronic integrated passive networks, integrated circuits and discrete components, resistors, capacitors, inductors, ESD diodes, Schottky diodes, transient surge suppressors, TVS transorb and Zener diodes, include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package, MSOP-mini small outline package,MLP-micro leadframe package, MILLIPAQ- micro package, QSOP- quarter size smal outline package,SSBGA-small scale ball grid array-wire bond, SSBGA-FC small scale ball grid array-flip chip, SDBGA-small scale ball grid array-stacked die, SOIC-small outline integrated circuit,SOICW-small outline integrated circuit wide body, SOT-small outline transistor,SSOP-shrink small outline package, TSSOP-thin shrink small outline package, FCOL-flip chip on lead frame-Carsem TM,MQFP-metric quad flat pack, LQFP-low quad flat pack,TQFP-thin quad flat pack, VSOP-very small outline package.

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Last updated: July 06, 2009

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